Resin sealed-type semiconductor device and method of manufacturing the same

摘要

On a semiconductor element in the which a circuit pattern and electrodes are formed on a circuit forming surface, a plurality of leads, which are formed by a strip-shaped metal piece having a rectangular exposed portion, are disposed in parallel at predetermined intervals and are electrically connected to each of the electrodes. Molding is effected by a resin so as to cover portions of the plurality of leads other than the exposed portions and to cover the circuit forming surface and side surfaces of the semiconductor element. Flux for soldering is applied to at least one of spherical solders and the exposed portions. The spherical solder is disposed one by one on each of the exposed portions so as to form a zigzag in a direction in which the plurality of leads are arranged. The solder is heated and melted such that the solder bump which covers the entire surface of the rectangular exposed portion is formed by the melted solder.