发明名称 Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning
摘要 A method and apparatus for trimming a discrete surface-mounted component or a component integrated in a substrate including providing a trimmable structure mounted on the surface of a substrate for each component to be trimmed. In an exemplary embodiment, the component to be trimmed is a capacitor. In another exemplary embodiment, the trimmable structure is one electrode of a trimmable capacitor whose other electrode is integrated in the substrate, and the trimmable capacitor is connected in parallel with a surface mounted capacitor to be trimmed.
申请公布号 SE516152(C2) 申请公布日期 2001.11.26
申请号 SE19990000960 申请日期 1999.03.17
申请人 TELEFONAKTIEBOLAGET L M ERICSSON 发明人 LARS-ANDERS *OLOFSSON
分类号 H01C17/22;H01C17/242;H01G13/00;H05K1/00;H05K1/02;H05K1/11;H05K1/16;H05K1/18;H05K3/02;(IPC1-7):H05K1/16;H01G4/224 主分类号 H01C17/22
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