发明名称 |
Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning |
摘要 |
A method and apparatus for trimming a discrete surface-mounted component or a component integrated in a substrate including providing a trimmable structure mounted on the surface of a substrate for each component to be trimmed. In an exemplary embodiment, the component to be trimmed is a capacitor. In another exemplary embodiment, the trimmable structure is one electrode of a trimmable capacitor whose other electrode is integrated in the substrate, and the trimmable capacitor is connected in parallel with a surface mounted capacitor to be trimmed. |
申请公布号 |
SE516152(C2) |
申请公布日期 |
2001.11.26 |
申请号 |
SE19990000960 |
申请日期 |
1999.03.17 |
申请人 |
TELEFONAKTIEBOLAGET L M ERICSSON |
发明人 |
LARS-ANDERS *OLOFSSON |
分类号 |
H01C17/22;H01C17/242;H01G13/00;H05K1/00;H05K1/02;H05K1/11;H05K1/16;H05K1/18;H05K3/02;(IPC1-7):H05K1/16;H01G4/224 |
主分类号 |
H01C17/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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