发明名称 |
METHOD FOR MANUFACTURING DIGITAL MICRO-MIRROR DEVICE PACKAGE |
摘要 |
A method for manufacturing a semiconductor package is disclosed. A wafer including a plurality of semiconductor chips is provided. Each chip has one or more mirrors mounted thereon. Further, a plurality of bond pads formed on a periphery of the chip. Next, a photoresist is formed over the one or more mirrors. Then, the semiconductor chips are singulated from the wafer. One ore more semiconductor chips are mounted on a base substrate. The bond pads of the semiconductor chip are electrically connected with the base substrate. The photoresist is then removed from the semiconductor chips. |
申请公布号 |
KR20010103891(A) |
申请公布日期 |
2001.11.24 |
申请号 |
KR20000024951 |
申请日期 |
2000.05.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, JONG GON |
分类号 |
G02B26/08;H01L21/50;(IPC1-7):H01L23/28 |
主分类号 |
G02B26/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|