A CIRCUIT DEVICE HAVING A PROTECTIVE COATING FORMED BY INJECTION MOLDING A REACTIVELY CURED MATERIAL

摘要

Circuit devices can be protectively encapsulated in a rubber material. The coating may be applied by injection molding a mixture of reactive components that form t he insulating rubber once cured. The injection of the liquid components minimiz es injury to the circuit components, while achieving a high degree of defect free coating. The coated circuit devices are then resistant to water and other environmental effects. Heat distribution is controlled. The exterior may be further metallized and grounded to limit electromagnetic interference.