发明名称 Electrical connector grid of integrated circuit has circumferential part with softer electrical conductive covering preventing escape of molding material when held by parts of encapsulation mold
摘要 Electrical connector grid forming part of an integrated circuit has a circumferential part designed to be held between opposed parts of an injection mold used to encapsulate the circuit. The circumferential part of the grid is covered with a softer electrically conductive material that prevents molding material escaping between the opposed parts of the mold. The softer covering may extend near to or up to the mold cavity and is subsequently used for forming soldered connections.
申请公布号 FR2809232(A1) 申请公布日期 2001.11.23
申请号 FR20000006518 申请日期 2000.05.22
申请人 STMICROELECTRONICS SA 发明人 ABELA JONATHAN;BRECHIGNAC REMI
分类号 H01L21/56;H01L23/495 主分类号 H01L21/56
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