| 摘要 |
An apparatus for polishing wafers wherein a retainer ring 40 is held by a carrier 32 of a wafer-holding head 20 by using an O-ring 31. Further, a protection sheet 80 for a wafer 2 is held by the retainer ring so as to cover the surface of an air-blow member 34 of the carrier. While the wafer is being held and polished, therefore, the back surface of the wafer does not come into direct contact with the carrier, and the protection sheet is interposed between the back surface of the wafer and the carrier. |
