| 摘要 |
<p>Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710 DEG C, and which stably seals with Dumet. Further, when the glass has a viscosity of 10<6> dPa.s, the temperature of said glass is not higher than 710 DEG C, and includes two or more of Li2O, Na2O and K2O and B2O3. Also, the glass may comprise: SiO2, B2O3 and Al2O3 in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight.</p> |
