| 摘要 |
A method and apparatus for distributing a mold material in a mold for packaging microelectronic devices. In one embodiment, the microelectronic devices are placed on a substrate and the substrate is at least partially enclosed by the device region of a mold cavity. A mold material is passed along a flow axis through at least one entrance port into an intermediate region of the mold. The mold material is then passed from the intermediate region into the device region through a single opening spaced apart from and positioned between the entrance port and the microelectronic device. The single opening has a flow area transverse to the flow axis smaller than a flow area immediately upstream of the single opening to restrict the flow through the single opening. The mold material can accordingly form a uniform leading edge as it exits the opening and before it impinges on the microelectronic device. |
