发明名称 |
METHOD FOR CONNECTING AND ADHERING BUILDING DECORATIVE BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for connecting and adhering a building decorative board capable of simply and accurately connecting between connecting end faces to be butted and connected while integrating in the case of connecting adhering the decorative board such as a floor plate, a wall plate or the like. SOLUTION: The method for connecting and adhering the building decorative board comprises the steps of disposing a high-frequency induction heater and an adhesive layer made of a hot-melt adhesive on one connecting end face to be connected to an adjacent building decorative plate in a butted state, heating and melting the adhesive layer from the front side of the decorative board by the heater, then radiating and solidifying the adhesive layer to adhere and integrate the connecting end faces of the decorative boards with each other. When refurnished or disassembled, the adhesive layer is softened and melted by the heater, and the decorative board is efficiently removed.
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申请公布号 |
JP2001322104(A) |
申请公布日期 |
2001.11.20 |
申请号 |
JP20000143547 |
申请日期 |
2000.05.16 |
申请人 |
DAIKEN TRADE & IND CO LTD |
发明人 |
SHIMADA TAKASHI;NAGAI SADAMICHI;ONO TAKASHI |
分类号 |
B27M3/00;C09J5/06;C09J7/02;C09J9/02;C09J201/00;E04F13/08;E04F13/21;E04F15/00;(IPC1-7):B27M3/00 |
主分类号 |
B27M3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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