发明名称 SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a soldering device with which the soldering of the terminal pats of small electric parts can be easily and uniformly performed. SOLUTION: This soldering device is equipped with a soldering device main body 3 having an opening 2 on its upper surface, a soldering bath 4 whose upside is opened toward the above opening 2, a heating means 5 heating the soldering bath 4, a rotating means 6 rotating the above soldering bath 4 and a metal plate 8 fixed on the above soldering device main body 2 so that the whole of a tip part 8a having a prescribed width is immersed in a prescribed circle A having the same center as that of the above rotation included in the surface 7a of solder 7 in the above soldering bath 4.
申请公布号 JP2001321931(A) 申请公布日期 2001.11.20
申请号 JP20000138079 申请日期 2000.05.11
申请人 WAKOO:KK 发明人 SHIMODA TORAO
分类号 B23K3/06;B23K1/00;B23K3/00;H05K3/34;(IPC1-7):B23K3/06 主分类号 B23K3/06
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