发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF FORMATION |
摘要 |
An interconnect overlies a semiconductor device substrate (10). In one embodiment, a conductive barrier layer overlies a portion of the interconnect, a passivation layer (92) overlies the conductive barrier layer and the passivation layer (92) has an opening that exposes portions of the conductive barrier layer (82). In an alternate embodiment a passivation layer (22) overlies the interconnect, the passivation layer (22) has an opening (24) that exposes the interconnect and a conductive barrier layer (32) overlies the interconnect within the opening (24). |
申请公布号 |
SG84587(A1) |
申请公布日期 |
2001.11.20 |
申请号 |
SG20000001904 |
申请日期 |
2000.04.04 |
申请人 |
MOTOROLA, INC. |
发明人 |
ALEXANDER L. BARR;SURESH VENKATESAN;DAVID B. CLEGG;REBECCA G. COLE;OLUBUNMI ADETUTU;STUART E. GREER;BRIAN G. ANTHONY;RAMNATH VENKATRAMAN;GREGOR BRAECKELMANN;DOUGLAS M. REBER;STEPHEN R. CROWN |
分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L21/768;H01L23/485;H01L23/532 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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