| 摘要 |
There is provided a lead frame including first and second rows of inner leads each of which is electrically connected to an associated electrode of a semiconductor chip and which are situated at opposite sides about the semiconductor chip, first and second rows of outer leads each of which is electrically connected to an associated inner lead in the first and second rows of inner leads, respectively, a tie bar connecting a first outermost inner lead in the first row of inner leads to a second outermost inner lead in the second row of inner leads, and a control plate comprised of first branches extending from the first outermost inner lead towards the second outermost inner lead and second branches extending from the second outermost inner lead towards the first outermost inner lead, the control plate being connected to the tie bar. Since the control plate is connected to the tie bar, the control plate is stabilized without being influenced by flow of resin introduced into a cavity in a step of sealing a semiconductor device with resin.
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