发明名称 Resin transfer molding process
摘要 The present invention relates to a seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/resin seal pin of the present invention for RTM mold dies is novel in that it provides the seal (via replaceable O-rings) on the threaded stem of the pin to prevent low viscosity resin from invading the threads, bolts pins, or other elements of the internal mandrel. The pin allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system. The invention also relates to a method for using the seal pin in a resin transfer molding process.
申请公布号 US6319447(B1) 申请公布日期 2001.11.20
申请号 US20000544652 申请日期 2000.04.06
申请人 THE BOEING COMPANY 发明人 CUNDIFF THOMAS R.;MILLER SCOTT A.;CONAWAY DONALD L.
分类号 B29C70/48;(IPC1-7):B27N3/10 主分类号 B29C70/48
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