发明名称 Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device
摘要 Surfaces of diamond crystals are examined by coating the surfaces with thin metal films, launching laser beams to the diamond surfaces in a slanting angle, detecting defects and particles on the diamond surfaces by the scattering of beams and counting the defects and particles by a laser scanning surface defect detection apparatus. Diamond SAW devices should be made on the diamond films or bulks with the defect density less than 300 particles cm-2. Preferably, the diamond surfaces should have roughness less than Ra20 nm. Diamond SAW filters can be produced by depositing a piezoelectric film and making interdigital transducers on the low-defect density diamond crystals.
申请公布号 US6320296(B1) 申请公布日期 2001.11.20
申请号 US20010825887 申请日期 2001.04.05
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 FUJII SATOSHI;SEKI YUICHIRO;YOSHIDA KENTARO;NAKAHATA HIDEAKI;HIGAKI KENJIRO;KITABAYASHI HIROYUKI;UEMURA TOMOKI;SHIKATA SHIN-ICHI
分类号 C30B29/04;C23C14/34;G01N21/47;G01N21/55;G01N21/88;H01L41/09;H03H3/08;H03H9/02;H03H9/25;(IPC1-7):H10L41/08 主分类号 C30B29/04
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