发明名称 |
Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device |
摘要 |
Surfaces of diamond crystals are examined by coating the surfaces with thin metal films, launching laser beams to the diamond surfaces in a slanting angle, detecting defects and particles on the diamond surfaces by the scattering of beams and counting the defects and particles by a laser scanning surface defect detection apparatus. Diamond SAW devices should be made on the diamond films or bulks with the defect density less than 300 particles cm-2. Preferably, the diamond surfaces should have roughness less than Ra20 nm. Diamond SAW filters can be produced by depositing a piezoelectric film and making interdigital transducers on the low-defect density diamond crystals.
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申请公布号 |
US6320296(B1) |
申请公布日期 |
2001.11.20 |
申请号 |
US20010825887 |
申请日期 |
2001.04.05 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
FUJII SATOSHI;SEKI YUICHIRO;YOSHIDA KENTARO;NAKAHATA HIDEAKI;HIGAKI KENJIRO;KITABAYASHI HIROYUKI;UEMURA TOMOKI;SHIKATA SHIN-ICHI |
分类号 |
C30B29/04;C23C14/34;G01N21/47;G01N21/55;G01N21/88;H01L41/09;H03H3/08;H03H9/02;H03H9/25;(IPC1-7):H10L41/08 |
主分类号 |
C30B29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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