发明名称 |
Method of manufacturing semiconductor device, semiconductor equipment and manufacturing system |
摘要 |
A manufacturing system compares information of foreign matter sensed by semiconductor equipment from on a semiconductor substrate with a selection reference thereby selecting optimum semiconductor equipment corresponding to the information of the foreign matter from a plurality of semiconductor equipment and processing the semiconductor substrate. Thus, a method of manufacturing a semiconductor device capable of improving the yield of the semiconductor device as well as a manufacturing system and semiconductor equipment to which the manufacturing method is applied, and a semiconductor device manufactured by the same are obtained.
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申请公布号 |
US6319733(B1) |
申请公布日期 |
2001.11.20 |
申请号 |
US19990395219 |
申请日期 |
1999.09.14 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OZAKI HIROJI |
分类号 |
H01L21/304;H01L21/66;(IPC1-7):G01R31/26;H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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