发明名称 Method of manufacturing semiconductor device, semiconductor equipment and manufacturing system
摘要 A manufacturing system compares information of foreign matter sensed by semiconductor equipment from on a semiconductor substrate with a selection reference thereby selecting optimum semiconductor equipment corresponding to the information of the foreign matter from a plurality of semiconductor equipment and processing the semiconductor substrate. Thus, a method of manufacturing a semiconductor device capable of improving the yield of the semiconductor device as well as a manufacturing system and semiconductor equipment to which the manufacturing method is applied, and a semiconductor device manufactured by the same are obtained.
申请公布号 US6319733(B1) 申请公布日期 2001.11.20
申请号 US19990395219 申请日期 1999.09.14
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OZAKI HIROJI
分类号 H01L21/304;H01L21/66;(IPC1-7):G01R31/26;H01L21/44;H01L21/48;H01L21/50 主分类号 H01L21/304
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