| 摘要 |
A resin sealing film is formed on a silicon substrate by using a printing mask and a squeegee. The side surface in the tip portion of the squeegee is substantially V-shaped, and the printing is performed by pushing the tip portion of the squeegee into the gap between adjacent bump electrodes. As a result, the sealing film is formed in a manner to be depressed in the region between adjacent bump electrodes so as to facilitate the swinging movement of the bump electrodes. It follows that, in a temperature cycle test performed after the silicon substrate is mounted to a circuit substrate, the stress derived from the difference in thermal expansion coefficient between the silicon substrate and the circuit substrate is absorbed by the bump electrode.
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