发明名称 SOLDER PASTE AND METHOD FOR SOLDERING ELECTRONIC PARTS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide solder powder of an Sn-Zn alloy which may be stored in the atmosphere, allows the use of devices used heretofore as they are and allows the implementation of a soldering process step in the atmosphere. SOLUTION: The solder powder of the Sn-Zn alloy of which the area >=50% of the surface is coated with a layer of an Sn alloy consisting essentially of Sn and containing at least one element of Ag, In, Ge, Cu or Bi.
申请公布号 JP2001321983(A) 申请公布日期 2001.11.20
申请号 JP20000143659 申请日期 2000.05.16
申请人 CANON INC 发明人 HAGA SHUNICHI
分类号 B23K1/00;B22F1/02;B23K35/22;B23K35/26;B23K35/40;H05K3/34;(IPC1-7):B23K35/26 主分类号 B23K1/00
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