Semiconductor device, and a manufacturing apparatus for a method of manufacturing the semiconductor device

摘要

A semiconductor manufacturing apparatus includes a film feeder for sequentially feeding a die bonding film; and a film piece cutter for cutting a die bonding film piece having a shape and dimension from the die bonding film fed by the film feeder. Further, the film piece cutter includes a male blade member which has a cutting blade at circumferential edges, reciprocated along a direction, and a female blade member which has an opening and a receiving blade corresponding to the cutting blade of the male blade member at an inner circumferential edge of the opening. The male blade member and the female blade member are alterable, and thus, it is possible to change the shape and dimension of the film piece defined by the cutting blades.