Power semiconductor module

摘要

A power semiconductor module in which at least one semiconductor chip with which contact is made by pressure is electrically connected via a contact element to a main connection. The contact element has two planar contact surfaces, between which a spring element is located. Irrespective of the individual position and height of a chip, the respective spring element ensures a standard contact force. Overloading of the semiconductor chips when the module is being clamped in is prevented by ceramic supporting elements.