发明名称 Method for forming a memory cell
摘要 A new capacitor structure for Flash memory (Flash) cells on a supporting substrate's existing topography, including existing topography provided by adjacent word lines is provided. The gate of the Flash memory cell is constructed as an integral part of the new capacitor cell structure. An increased capacitive coupling ratio is achieved whereby reduced programming voltage is required while yielding more a more compact memory cell structure. Hence, the requirements of low power densely packed integrated circuits is realized for smaller, portable microprocessor devices. Methods for forming the above stated novel capacitor for Flash memory (Flash) cells on a supporting substrate's existing topography is similarly included.
申请公布号 US6319774(B1) 申请公布日期 2001.11.20
申请号 US19980044215 申请日期 1998.02.27
申请人 MICRON TECHNOLOGY, INC. 发明人 HAI TRAN T.
分类号 H01L21/28;H01L21/8247;H01L27/115;H01L29/423;(IPC1-7):H01L21/336 主分类号 H01L21/28
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