| 摘要 |
PROBLEM TO BE SOLVED: To leave no such streaks as to cause a chip to break easily, on the chip by uniforming the direction of streaks left on a wafer after finish-grinding when finish-grinding by a one-side grinding device. SOLUTION: A finish-grinding wheel 3 formed of a cup type grinding wheel larger in diameter than a wafer W is rotated to finish-grind one side of the wafer W. At this time, the wafer W is at a stop without rotating, and the finish-grinding wheel 3 is linearly moved along the ground surface of the wafer W while abutting on the ground surface of the wafer W. The streaks on the ground surface of the wafer W ground by the finish-grinding wheel 3 can thereby be uniformed in circular arc shape swollen in the moving direction of the finish-grinding wheel 3.
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