发明名称 RESIN COMPOSITION FOR HIGH-FREQUENCY SEALING
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for high-frequency sealing which becomes an excellent exothermic body under a high frequency without serious detriment to the clarity of a molded article. SOLUTION: This resin composition comprises (A) a saponified ethylene-vinyl acetate copolymer having an ethylene content of 50-99 wt.% and (B) an ethylene copolymer, especially an ethylene-vinyl acetate copolymer, having a refractive index different from that of copolymer A by 0.01 or less in terms of absolute value.
申请公布号 JP2001323120(A) 申请公布日期 2001.11.20
申请号 JP20000138917 申请日期 2000.05.11
申请人 SUMITOMO CHEM CO LTD 发明人 FUJITA HARUNORI
分类号 C08L23/26;C08L23/08;(IPC1-7):C08L23/26 主分类号 C08L23/26
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