| 发明名称 |
SN-AG-CU-BI-BASE SOLDER FOR ELECTRONIC APPARATUS |
| 摘要 |
PROBLEM TO BE SOLVED: To provide solder for an electronic instrument having improved mechanical strength. SOLUTION: This solder consists of 1 to 3 mass % Ag, 0.5 to 1.0 mass % Cu, 10 to 20 mass % Bi, 0.01 to 0.03 mass % Ge or 0.01 to 0.1 mass % Se and the balance Sn.
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| 申请公布号 |
JP2001321981(A) |
申请公布日期 |
2001.11.20 |
| 申请号 |
JP20000152661 |
申请日期 |
2000.05.18 |
| 申请人 |
HITACHI LTD |
发明人 |
SERIZAWA KOJI;SOGA TASAO;SHIMOKAWA HIDEYOSHI;NAKATSUKA TETSUYA;OKUDAIRA HIROAKI;MIURA KAZUMA;ISHIDA TOSHIHARU;YAMADA KOSUKE |
| 分类号 |
B23K35/26;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
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