发明名称
摘要 PURPOSE:To obtain a heat resistant, eletrically conductive carrier tape which is excellent in a heat resistance, a mechanical property and an electrical conductivity, and used for packaging of integrated circuits and electronic parts. CONSTITUTION:On one side or both sides of a substrate layer which consists of polyphenylene ether group resin composition which contains 38-96 parts by weight of polyphenylene ether resin and 62-4 parts by weight of polystyrene group resin, an electrically conductive layer which consists of 100 parts by weight of polyphenylene ether group resin composition which has less 5-40 parts by weight of polyphenylene resin than polyphenylene ether group resin composition which constitutes the substrate layer and 4-50 parts by weight of electrical conductivity-imparting material are integrally laminated by pressing together. The heat resistant, electrically conductive plastic sheet is provided with embossing, and the heat resistant, electrically conductive carrier tape is manufactured.
申请公布号 JP3231119(B2) 申请公布日期 2001.11.19
申请号 JP19930015448 申请日期 1993.02.02
申请人 发明人
分类号 B29C47/06;B29K25/00;B29K71/00;B29L9/00;B32B27/00;B32B27/18;B32B27/30;B65D85/00;B65D85/38;B65D85/86;(IPC1-7):B32B27/00 主分类号 B29C47/06
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