| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package for a semiconductor laser module, having high heat radiating property and superior in strength. SOLUTION: The package for a semiconductor laser module is made of a copper-tungsten alloy and is obtained by preparing a copper-tungsten mixture powder, by mixing tungsten powder having 0.1 to 5μm for the average particle size with copper powder, while controlling the content of the copper powder to 10 to 30 wt.%, and then forming the mixture powder into the package by a metal powder injection molding method.
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