| 摘要 |
PROBLEM TO BE SOLVED: To prevent plating defects in a semiconductor wafer W resulted from the slightly remaining air as shown in Fig. 6 (c), because a placing part 2A of supporting body 2 is so thick that the remaining air in a treated surface of the semiconductor wafer W can not be extracted. SOLUTION: A sheet 17 for a cathode comprises a flexible sheet 17A which can conduct to a semiconductor wafer W and is composed releasably and covers at least an outer circumferential edge part of a semiconductor wafer W, a cathode part 17B which is formed to be a thin film all over the circumference on the flexible sheet and can conduct to the supporting body for holding a semiconductor wafer W, and a jointing part 17C serving as a seal as well.
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