| 摘要 |
PROBLEM TO BE SOLVED: To package a semiconductor chip without any damage even if the semiconductor chip at an upper side is large in a stacked package where the semiconductor chip is stacked. SOLUTION: On an interposer substrate 11, a first chip 12 is packaged. On the back surface of the first chip 12, a second chip 13 that is larger than the first one 12 is mounted. The second chip 13 is wire-bonded to the interposer substrate 11 by a wire 15. At the outside of the first chip 12, a rest member 17 is arranged. The first and second chips 12 and 13 and rest member 17 are molded by a sealing resin 16. A soldering ball 18 is provided at a side opposite to the chip-packaging side on the interposer substrate 11. |
