| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem where thermal characteristic or the like is deteriorated since a resistor element 3 for terminating a signal pattern 4 is arranged just below a semiconductor element 10, in the conventional optical semiconductor device using the semiconductor element 10 for converting signal components between an optical signal and an electrical signal. SOLUTION: The resistive element 3 for terminating a high frequency signal is mounted on a surface different from a mounting surface of the semiconductor element 10 of a high frequency circuit board 1 on which the semiconductor element 10 is mounted, so that the semiconductor element is hardly affected by heat generation of the terminating resistive element.</p> |
