发明名称 BOARD FOR MOUNTING ELECTRONIC PART
摘要 <p>PROBLEM TO BE SOLVED: To provide a board for mounting an electronic part with superior electric characteristics and reliability in electronic connection between a wall face pattern and a bonding pad. SOLUTION: The board for mounting an electronic part has a recessed part 7 for mounting the electronic part, a wall face pattern on the side wall of the recessed part for mounting the electronic part, and a bonding pad 5 connected to the wall face pattern 6. The wall face pattern 6 and the bonding pad 5 are connected with a belt-shaped pattern 1 elongated along an opening step 21 of the mounting recessed part 7. In this case, the bonding pad 5 has a connection 58 to be connected with the belt-shaped pattern 1, and at least the connection part 58 is a curved part preferably.</p>
申请公布号 JP2001319945(A) 申请公布日期 2001.11.16
申请号 JP20010052472 申请日期 2001.02.27
申请人 IBIDEN CO LTD 发明人 OBARA YASUHIRO
分类号 H01L23/12;H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L23/12
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