ALIGNMENT-MARK POSITION MEASURING METHOD, PATTERN EXPOSURE SYSTEM, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING PLANT, AND PATTERN EXPOSURE SYSTEM MAINTAINING METHOD

摘要

PROBLEM TO BE SOLVED: To immediately remove a measurement result or to measure an alternative position when an error measurement occurs or a predetermined measuring accuracy deteriorates. SOLUTION: In an alignment mark position measuring method for sequentially measuring positions of a plurality of alignment marks on an object necessary for aligning the object, every time the positions of one or a predetermined number of alignment marks are measured (step S3), an error measurement or the presence or absence of deterioration of a predetermined measuring accuracy is detected (step S9).