HEAT SINK AND ITS MANUFACTURING METHOD AND COOLING DEVICE USING HEAT SINK

摘要

PROBLEM TO BE SOLVED: To provide a heat sink and its manufacturing method that improves performance of radiating heat that is generated from high-heat-generation electronic components, and at the same time reduces size and weight, and a cooling device that uses the beat sink. SOLUTION: This heat sink is composed of a post 2 that has pole-shaped structure projecting to a side opposite to a heat reception surface that is opposingly in contact with an electrical heating element 3, and a plurality of plate- shaped fins 1 or pin-shaped fins 1a that are provided at the side of the post 2, In the heat sink, each plate-shaped fin 1 or pin-shaped fin 1a is isolated by a plurality of slits that are provided in a direction crossing at least the heat reception surface. The heat sink is combined with a cooling fan 4 for composing the cooling device.