| 摘要 |
PROBLEM TO BE SOLVED: To provide an equipment, a system, and a method for a plating, which can inhibit contamination in a plating equipment and system due to drips or spread of plating liquid, occurring on the transportation way after plating treatment, by means of washing a wafer W after plating. SOLUTION: The liquid treating equipment comprises a liquid treating tank 100 composed to be capable of housing the plating liquid and cleaning nozzles 200 for washing the wafer W, which can supply the cleaning liquid from a bottom side of the wafer W.
|
