发明名称 ANTI-ALGAL COPPER COATING MATERIAL AND ANTI-ALGAL METHOD USING THE COPPER COATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an anti-algal method capable of inhibiting generation/ adhesion of alga even without covering, with a copper plate, the contact surface with running water or storage water in various water treatment facilities including sewage treatment facilities. SOLUTION: An anti-algal copper coating material comprising a flaked copper powder, a fibrous copper powder, and a resin binder is coated on the surfaces of water treatment facilities which are in contact with the water to be treated to form a surface with fine irregularities by the flaked copper powder and the fibrous copper powder on the coating surfaces, resulting in prevention of generation of alga on the contact surfaces with the water to be treated.
申请公布号 JP2001316631(A) 申请公布日期 2001.11.16
申请号 JP20000137963 申请日期 2000.05.11
申请人 FUKUDA METAL FOIL & POWDER CO LTD;NIKKI PLAN TEC KK;FUJI ULTRASONIC ENGINEERING CO LTD 发明人 KAJITA OSAMU;HIRAI KIYOSHI;ONISHI TOSHIKI;MIYAI TAKASHI;NAKAJIMA MASAKI;NAKAJIMA SHUICHI
分类号 C09D201/00;C09D5/16;C09D7/12;(IPC1-7):C09D201/00 主分类号 C09D201/00
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