| 摘要 |
PROBLEM TO BE SOLVED: To provide the BLANK of a light emitting diode and its manufacturing method in which the bottom part is not sealed hermetically at the time of molding and heat can be dissipated. SOLUTION: A seat piece 3 extending in the central direction is provided in the vicinity of the intermediate part of a connection leg 1, at least one wing piece 4 corresponding to the seat piece 3 is provided on the side face thereof, the wing piece 4 is folded onto the seat piece 3 and when a conical bottom seat for mounting a chip is molded, conical bottom part of a seat body 5 having increased thickness is exposed from a molding material. |
