| 摘要 |
PROBLEM TO BE SOLVED: To remove an unnecessary thin film on the periphery of a substrate without scattering a processing liquid over the area of preparing devices of the substrate. SOLUTION: While a substrate is turned, a first processing liquid is applied to the periphery of one surface of the substrate through a first nozzle, and a second processing liquid is applied thereto through a second nozzle, thereby mixing the first and second processing liquids to remove a thin film on the periphery of the substrate. Then the processing liquids are sucked from a suction port arranged near the periphery of the substrate. |
