| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card, which is superior in strength against bending or point pressure and also superior in heat transfer characteristics at the time of card production, capable of equally heating and hardening the whole of an adhesive agent layer when producing the IC card, and a producing method therefor. SOLUTION: Concerning the IC card, with which an inlet sheet 1 mounting an IC chip 3 on it is sandwiched between overlay films 6 and 7 on the front and rear sides and integrally adhered with heat reacting adhesive agents 8 and 9, at a position facing the IC chip 3 between the inlet sheet 1 and the front overlay film 6, a plastic reinforcing plate 10 for IC chip protection is buried for covering the upper surface of the IC chip and at a position facing the IC chip 3 between the inlet sheet 1 and the rear overlay film 7, a plastic reinforcing plate 11 for IC chip protection is buried for covering the lower surface of the IC chip. Besides, an aramid fiber substrate laminated in a prescribed thickness by impregnating epoxy resins in aramid fibers is used as a plastic reinforcing plate. |
