发明名称 ELECTRICAL INSULATING RESIN COMPOSITION, COPPER-FOILED ELECTRICAL INSULATING MATERIAL AND COPPER-CLAD LAMINATED BOARD
摘要 PROBLEM TO BE SOLVED: To provide the subject resin composition flame-retardative without using any halogen-based flame retardant, capable of making non-halogen-based flame-retardant copper-foiled electrical insulating materials, and also excellent in heat resistance and reliability, and to obtain such copper-foiled electrical insulating materials and copper-clad laminated boards each excellent in flame retardancy, heat resistance and reliability and capable of responding to the demand for environmental compatibility by using the above resin composition. SOLUTION: This resin composition essentially comprises an epoxy resin, an epoxy resin curing agent, electrical insulating whisker, metal hydroxide(s) and a multiple oxide of flame-retarding auxiliary.
申请公布号 JP2001316563(A) 申请公布日期 2001.11.16
申请号 JP20000134258 申请日期 2000.04.28
申请人 HITACHI CHEM CO LTD 发明人 OGAWA NOBUYUKI;HORIUCHI TAKESHI
分类号 C08L63/00;C08G59/44;C08G59/62;C08K3/22;C08K3/24;C08K3/38;C08K5/521;H01B3/40;(IPC1-7):C08L63/00 主分类号 C08L63/00
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