| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method using a liquid which prevents undissolved components contained in a process liquid from adhering to a substrate such as semiconductor wafer to be processed and reduces the residual liquid of the process liquid in processing the substrate, etc., with the liquid. SOLUTION: The process method comprises a first step (step 4) of spinning a substrate at a low speed with feeding a separate process liquid to the substrate to thereby suppress electrostatic charges from occurring, and holding for a specified time when the substrate is spun to remove a process liquid on the substrate after feeding this liquid to the substrate; and a second step (step 5) of holding the substrate spinning at a higher speed than that in the first step for a specified time, thereby reducing the residual of the process liquid. |
