| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing the surface of a substrate uniformly with liquid by preventing voltage drop in the central part of the substrate. SOLUTION: A seed layer 80 having a thicker central part 79 as compared with the outer circumferential fringe part 78 is formed on the surface of a wafer W to be plated by means of a PVD system. A plated layer is formed on the surface of the wafer W on which the seed layer 80 is formed.
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