发明名称 PACKAGED INTEGRATED CIRCUIT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a system and method for grasping the operation function of an integrated circuit chip. SOLUTION: An integrated circuit chip that has an operation function, and a body that at least partially surrounds the integrated circuit chip are provided, and the color of the body indicates the operation function of the integrated circuit chip.
申请公布号 JP2001319983(A) 申请公布日期 2001.11.16
申请号 JP20010041609 申请日期 2001.02.19
申请人 LUCENT TECHNOL INC 发明人 GRANAHAN MARK E;LOUIS THOMAS MANGIONI;WARWICK COLIN ALAN
分类号 H01L23/00;H01L23/544;(IPC1-7):H01L23/00 主分类号 H01L23/00
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