发明名称 |
PACKAGED INTEGRATED CIRCUIT AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a system and method for grasping the operation function of an integrated circuit chip. SOLUTION: An integrated circuit chip that has an operation function, and a body that at least partially surrounds the integrated circuit chip are provided, and the color of the body indicates the operation function of the integrated circuit chip.
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申请公布号 |
JP2001319983(A) |
申请公布日期 |
2001.11.16 |
申请号 |
JP20010041609 |
申请日期 |
2001.02.19 |
申请人 |
LUCENT TECHNOL INC |
发明人 |
GRANAHAN MARK E;LOUIS THOMAS MANGIONI;WARWICK COLIN ALAN |
分类号 |
H01L23/00;H01L23/544;(IPC1-7):H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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