发明名称 LIQUID PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a liquid processing device capable of processing the edge of a substrate without causing an adverse effect to a device forming region and finely controlling the width of the edge of the substrate to process. SOLUTION: Chemicals are sprayed on the edge of a substrate from above its one side and then made to spread over the edge of the other side. The edge of the substrate is processed with the spreading chemicals, and the width of the processed edge of the substrate is controlled by a chemical spread control member provided on the other side of the substrate.
申请公布号 JP2001319910(A) 申请公布日期 2001.11.16
申请号 JP20000135224 申请日期 2000.05.08
申请人 TOKYO ELECTRON LTD 发明人 TANIYAMA HIROMI;NISHI HIRONOBU
分类号 B08B3/02;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 B08B3/02
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