| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that the plating layer of each semiconductor wafer has fluctuation in the thickness and hence, it is unstable because a specified motion of a holding body 2 is set and the semiconductor wafer W is subjected to a plating treatment while repeating a specified motion and the liquid level of the plating liquid successively consumed is not controlled. SOLUTION: In the electrolytic plating device 10, when a semiconductor wafer W is subjected to a copper plating by electrically connecting an anode 16 and a cathode 17 through the plating liquid 11 under the control of a controller 29, the holding body 18 is provided with a liquid level sensor 28 and the controller 29 optimizes the eletrolytic plating condition in every semiconductor wafer W on the basis of a signal from the liquid level sensor 28.
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