| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid treating equipment which can surely remove bubbles by absorbing the formed bubbles between a treating liquid and a surface to be treated of a substrate to be treated when the surface is contacted with a treating liquid, and the generating bubbles when an electric field is formed between a substrate to be treated and a liquid treating tank, and to provide the liquid treating method. SOLUTION: The liquid equipment comprises a Venturi tube 80 which is formed in a holding part 62 of a driver 61 and extending from inside of the holding part 62 to outside. The Venturi tube 80 is composed of a suction tube 81 for sucking bubbles and impurities and an injection pipe 84 for injecting sucked bubbles and impurities as mist, sucks the bubbles and impurities stuck in a surface to be plated of a wafer W by taking advantage of difference in pressure between an open end 82 located in the outside of the holding part 62 of the suction tube 81 and an open end 83 located in the inside of the holding part 62, and then, ejects the sucked bubbles and impurities towards an exhaust port 71 through the injection pipe 84.
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