THIN FILM DEPOSITION METHOD

摘要

PROBLEM TO BE SOLVED: To prevent the dislocation of a mask and the falling of a substrate in a single-substrate sputtering system, and to carry out the film deposition of a thin film having a sharp edge with masking by magnetron sputtering. SOLUTION: A magnet is provided to the rear of a substrate. In the region shielded with a mask on the substrate, the magnetic flux density by the magnet on the rear of the substrate is set so that it is higher by >=0.02 T than the magnetic flux density by a cathode magnet.