| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for film formation for insulation film formation which is excellent in storage stability and gives a coating film excellent in heat resistance, electrical insulation properties (with a relative permittivity of 2.5 or lower), crack resistance, and adhesiveness. SOLUTION: This composition for film formation contains (A) (A-1) a polyamide and/or polyimide having a hydrolysable organosilyl group or (A-2) a polyamic acid and/or polyimide prepared by reacting a tetracarboxylic dianhydride with an amine compound containing a polyamine having at least three amino groups, (B) a hydrolyzate and/or condensate of at least one silane compound selected from the group consisting of (B-1) compounds represented by the formula: R1aSi(OR2)4-a and (B-2) compounds represented by the formula: R3b(R4O)3-bSi-(R7)d-Si(OR5)3-cR6c, and (C) an organic polymer.
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