发明名称 STYRENIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a styrenic resin composition which has excellent moldability, excellent thermal stability and excellent secondary processability of printability. SOLUTION: This styrenic resin composition characterized by comprising 1 to 99 pts.wt. of a styrenic polymer obtained by an anion polymerization method and containing styrene monomer and styrene oligomers in a total amount of <1,000 ppm and 99 to 1 pts.wt. of a styrenic polymer obtained by a radical polymerization method.
申请公布号 JP2001316540(A) 申请公布日期 2001.11.16
申请号 JP20000134353 申请日期 2000.05.08
申请人 ASAHI KASEI CORP 发明人 SHIRAI HIROSHI;IKEMATSU TAKESHI
分类号 C08L25/04;C08F12/08;(IPC1-7):C08L25/04 主分类号 C08L25/04
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