| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip transfer device where a posture keeping transfer system and a posture inversion transfer system can be performed in the same device. SOLUTION: A chip supply 62, a transfer head unit 82, a driving part which vertically inverts the unit and a mounted head are installed. At the time of mounting a bare chip, a wafer holder 67 is pulled out from a wafer storage elevator 66 by a chip supply 62 and an XY stage 65 sets a bare chip 61 in a pickup position. The transfer head unit 82 picks up the bare chip in a face up state. In the case of the posture keeping transfer system, the bare chip is transferred to a transfer stage 63, is placed and is transferred to a mounter head unit. In the case of the posture inversion transfer system, an absorption nozzle is vertically inverted during transfer and it is transferred to a transfer position. Then, the bare chip in a face down state is directly transferred to the mounter head unit. |
