| 摘要 |
PROBLEM TO BE SOLVED: To prevent a case from being removed due to physical impact. SOLUTION: The edge emission semiconductor light emitting device 10 comprises a substrate 12 provided with a case 14 made of resin having opaqueness and reflectivity. The gap between the substrate 12 and the case 14 is filled with a translucent resin 16. Electrodes 18a, 18b are formed on the surface of the substrate 12 and boded with a LED chip 20. The case 14 is provided with an inverted truncated conical hole 24 directly above the LED chip 20 and that hole 24 is also filled with the translucent resin 16. More specifically, the case 14 and the translucent resin 16 are formed integrally into an unseparable structure. |
