发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high resolution, excellent particularly in the adhesion of thin lines and free of edge fusion. SOLUTION: The photosensitive resin composition contains a binder component (A), a monomer component (B) and a photopolymerization initiator (C). The binder component (A) contains at least an acrylic resin having a weight average molecular weight of 5,000-45,000 and the monomer component (B) contains at least a compound of formula (1) (where X1-X6 are each -CO-CR1= CH2 or -(CO-C5H10-O)m-CO-CR2=CH2 (R1 and R2 are each H or methyl and may be the same or different and (m) is an integer of 1-5) and at least two of X1-X6 are -(CO-C5H10-O)m-CO-CR2=CH2).
申请公布号 JP2001318461(A) 申请公布日期 2001.11.16
申请号 JP20000138028 申请日期 2000.05.11
申请人 NICHIGO MORTON CO LTD 发明人 TAKAMIYA HIROYUKI;HIUGA ATSUYOSHI;YAMAMOTO HISATOSHI
分类号 G03F7/027;C08F2/44;C08F2/50;C08F20/28;C08F265/00;G03F7/004;G03F7/031;G03F7/033 主分类号 G03F7/027
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