PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To improve reliability and productivity. SOLUTION: A recess 20 and a step part 21 are formed on an insulating board 11. A non-through connection hole 26 is formed at the recess 20 while a through connection hole 25 at the step 21 by a copper plating film 24. An electro-deposition film 27 is deposited on the copper plating film 24 by an electro-deposition coating. The electro-deposition film 27 is irradiated by parallel exposure light 31 through masks 30A and 30B to form a resist pattern.